Next-Generation Microelectronics Manufacturing (NGMM)
Funding Source
Implementing Entity
Due Date
Where the Opportunity is Offered
All of California
Eligible Applicant
Additional Eligibility Information
All responsible sources capable of satisfying the Government's needs may submit a proposal that shall be considered by DARPA. See the Eligibility Information section of the BAA for more information.
Contact
BAA Coordinator
Email
HR001122S0050@darpa.mil
Description
The NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation.
Category
Similar Oppportunities
Last Updated