Funding Wizard

The Faithful Integrated Reverse-Engineering and Exploitation (FIRE) seeks to develop tools that provide a transformative end-to-end capability from system acquisition to exploitation, including preparation.

The Minitherms3D program seeks to revolutionize thermal management for three-dimensional heterogeneous integration (3DHI). This program seeks to significantly reduce thermal resistances within the 3D stack and external to the stack of 3DHI systems, while increasing volumetric heat removal.

The DARPA Microsystems Technology Office is soliciting research proposals for the development of compact point-of-load (POL) voltage converters that are radiation-tolerant and efficient.

The NGMM program will establish a domestic center for R&D and manufacturing 3DHI (three-dimensional heterogeneous integration) microsystems through a subsequent Program Solicitation. The NGMM program will consist of three phases. Phase 0 research for this program (solicited through this HR001122S0050 BAA) will inform planning for the 3DHI manufacturing center by defining exemplar 3DHI microsystems and identifying the equipment, process, and facility requirements for manufacturing these microsystems. The NGMM program plans to establish the 3DHI manufacturing center through a separate, future solicitation.

The H6 program seeks to develop ultra-small, low-power, fieldable clocks that can maintain their timing precision for one week.